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Country CodeBOSCH
TEXAS INSTRUMENTS
STMICROELECTRONICS
Your search 30604 and relate product result :11 items
Description: HSSOP (High Speed Small Outline Package) Features: - Low profile package - High speed signal transmission - High density of pins - Low power consumption - High reliability Applications:
Stock:5000
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Description: HSOP (Heat Shrinkable Outline Package) Features: - Small size - Low profile - High thermal resistance - High reliability - Low cost Applications: HSOP packages are used in a variety of
Stock:10000
Minimum:2
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Package: HSOP Manufacturer: Bosch Description: The 30604 is a 16-pin HSOP (Heat Shrinkable Outline Package) from Bosch. It is a low-cost, high-performance integrated circuit designed for use in autom
Stock:306
Minimum:1
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Stock:488
Minimum:2
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Stop production experts, we can provide a large number of electronic components that have been stopped production and are difficult to find, to facilitate the maintenance company